Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8698232 | Semiconductor device including a voltage controlled termination structure and method for fabricating same | Timothy Henson, Ling Ma | 2014-04-15 |
| 7508052 | Crack protection for silicon die | Hugo Burke | 2009-03-24 |
| 6653740 | Vertical conduction flip-chip device with bump contacts on single surface | Daniel M. Kinzer, Tim Sammon | 2003-11-25 |