Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Molded package with chip carrier comprising brazed electrically conductive layers

Molded package with chip carrier comprising brazed electrically conductive layers

US Patent 10283432 · Granted May 7, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wafer-level package sensor device2025
Electronic module including a semiconductor package disposed on an interposer la2025
Embedded package with shielding pad2025
Semiconductor power module with crack sensing2025
Method for separating substrates2025
Semiconductor devices including parallel electrically conductive layers2025
Method for forming a semiconductor substrate arrangement2025
Voltage regulator module with inductor-cooled power stage2024
Semiconductor package and passive element with interposer2024
Method of forming a semiconductor module2024
Semiconductor die being connected with a clip and a wire which is partially disp2024
Methods of environmental protection for silicon MEMS structures in cavity packag2024