Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903120 | Semiconductor wafer dicing crack prevention using chip peripheral trenches | Gianmauro Pozzovivo | 2021-01-26 |
| 10256149 | Semiconductor wafer dicing crack prevention using chip peripheral trenches | Gianmauro Pozzovivo | 2019-04-09 |
| 9660037 | Semiconductor wafer and method | Annette Sanger, Ulrike Fastner, Beate Weissnicht, Stefan Krivec | 2017-05-23 |
| 9425090 | Method of electrodepositing gold on a copper seed layer to form a gold metallization structure | — | 2016-08-23 |
| 8502274 | Integrated circuit including power transistor cells and a connecting line | Kurt Matoy, Thomas Detzel, Michael Nelhiebel, Stefan Decker, Robert Illing +4 more | 2013-08-06 |