| 7368390 |
Photolithographic patterning process using a carbon hard mask layer of diamond-like hardness produced by a plasma-enhanced deposition process |
Guenther Czech, Carsten Fuelber, Maik Stegemann, Mirko Vogt, Stephan Wege |
2008-05-06 |
| 7141507 |
Method for production of a semiconductor structure |
Oliver Genz, Stephan Machill, Alexander Reb, Barbara Schmidt, Momtchil Stavrev +2 more |
2006-11-28 |
| 7078313 |
Method for fabricating an integrated semiconductor circuit to prevent formation of voids |
— |
2006-07-18 |
| 6759323 |
Method for filling depressions in a surface of a semiconductor structure, and a semiconductor structure filled in this way |
— |
2004-07-06 |
| 6713364 |
Method for forming an insulator having a low dielectric constant on a semiconductor substrate |
— |
2004-03-30 |
| 6677218 |
Method for filling trenches in integrated semiconductor circuits |
Martin Schrems |
2004-01-13 |
| 6673693 |
Method for forming a trench in a semiconductor substrate |
— |
2004-01-06 |
| 6562734 |
Method of filling gaps on a semiconductor wafer |
— |
2003-05-13 |
| 6483172 |
Semiconductor device structure with hydrogen-rich layer for facilitating passivation of surface states |
Donna R. Cote, William J. Cote, Son V. Nguyen, Max G. Levy, Manfred Hauf |
2002-11-19 |
| 6380074 |
Deposition of various base layers for selective layer growth in semiconductor production |
Hans-Peter Sperlich, Uwe Schilling, Zvonimir Gabric, Oswald Spindler, Stephan Wege +1 more |
2002-04-30 |
| 6380076 |
Dielectric filling of electrical wiring planes |
Michael Rogalli, Stephan Wege |
2002-04-30 |
| 6096654 |
Gapfill of semiconductor structure using doped silicate glasses |
Matthias Ilg |
2000-08-01 |
| 6057250 |
Low temperature reflow dielectric-fluorinated BPSG |
Ashima B. Chakravarti, Matthias Ilg, Kevin A. McKinley, Son V. Nguyen, Michael J. Shapiro |
2000-05-02 |
| 6048475 |
Gapfill of semiconductor structure using doped silicate glasses |
Matthias Ilg |
2000-04-11 |
| 5866485 |
Techniques for etching a silicon dioxide-containing layer |
Jochen Hanebeck |
1999-02-02 |
| 5807792 |
Uniform distribution of reactants in a device layer |
Matthias Ilg, Christoph Werner |
1998-09-15 |