MI

Matthias Ilg

SA Siemens Aktiengesellschaft: 13 patents #712 of 22,248Top 4%
IBM: 5 patents #18,733 of 70,183Top 30%
Lam Research: 3 patents #812 of 2,128Top 40%
Infineon Technologies Ag: 2 patents #91 of 446Top 25%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
📍 Fishkill, NY: #50 of 387 inventorsTop 15%
🗺 New York: #7,917 of 115,490 inventorsTop 7%
Overall (All Time): #260,228 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
6492282 Integrated circuits and manufacturing methods Dirk Tobben, Peter Weigand 2002-12-10
6492688 Dual work function CMOS device 2002-12-10
6376348 Reliable polycide gate stack with reduced sheet resistance and thickness Martin Schrems 2002-04-23
6319787 Method for forming a high surface area trench capacitor Gerhard Enders, Dietrich Widmann 2001-11-20
6262448 Memory cell having trench capacitor and vertical, dual-gated transistor Gerhard Enders, Lothar Risch, Dietrich Widmann 2001-07-17
6197666 Method for the fabrication of a doped silicon layer Herbert Schafer, Martin Franosch, Reinhard Stengl, Hans Reisinger 2001-03-06
6190955 Fabrication of trench capacitors using disposable hard mask Richard L. Kleinhenz, Soichi Nadahara, Ronald W. Nunes, Klaus Penner, Klaus Roithner +2 more 2001-02-20
6130145 Insitu doped metal policide Johnathan E. Faltermeier, Radhika Srinivasan 2000-10-10
6096654 Gapfill of semiconductor structure using doped silicate glasses Markus Kirchhoff 2000-08-01
6057250 Low temperature reflow dielectric-fluorinated BPSG Markus Kirchhoff, Ashima B. Chakravarti, Kevin A. McKinley, Son V. Nguyen, Michael J. Shapiro 2000-05-02
6048475 Gapfill of semiconductor structure using doped silicate glasses Markus Kirchhoff 2000-04-11
6027968 Advanced damascene planar stack capacitor fabrication method Son V. Nguyen, Kevin J. Uram 2000-02-22
5963837 Method of planarizing the semiconductor structure Dirk Tobben, Peter Weigand 1999-10-05
5935873 Deposition of carbon into nitride layer for improved selectivity of oxide to nitride etchrate for self aligned contact etching Bruno Spuler, Juergen Wittmann, Martin Gutsche, Wolfgang Bergner 1999-08-10
5928959 Dishing resistance Kai Huckels 1999-07-27
5807792 Uniform distribution of reactants in a device layer Markus Kirchhoff, Christoph Werner 1998-09-15
5770469 Method for forming semiconductor structure using modulation doped silicate glasses Kevin J. Uram, John Kevin Shugrue, Nathan Sandler, Son V. Nguyen 1998-06-23
5753948 Advanced damascene planar stack capacitor fabrication method Son V. Nguyen, Kevin J. Uram 1998-05-19