Issued Patents All Time
Showing 1–25 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11888010 | System-on-chip camera with integrated light sensor(s) and method of producing a system-on-chip camera | Thomas Stockmeier | 2024-01-30 |
| 11452199 | Electronic module with single or multiple components partially surrounded by a thermal decoupling gap | Markus Leitgeb, Steve Anderson | 2022-09-20 |
| 11411035 | System-on-chip camera with integrated light sensor(s) and method of producing a system-on-chip camera | Thomas Stockmeier | 2022-08-09 |
| 11313749 | Pressure sensor device and method for forming a pressure sensor device | Joerg Siegert, Willem Frederik Adrianus Besling, Coenraad Cornelis Tak, Franz Schrank | 2022-04-26 |
| 11271134 | Method for manufacturing an optical sensor and optical sensor | Gregor Toschkoff, Thomas Bodner, Franz Schrank, Miklos Labodi, Joerg Siegert | 2022-03-08 |
| 11201119 | RF functionality and electromagnetic radiation shielding in a component carrier | Markus Leitgeb, Erich Schlaffer, Steve Anderson | 2021-12-14 |
| 10790234 | Embedding known-good component in known-good cavity of known-good component carrier material with pre-formed electric connection structure | Marco Gavagnin, Markus Leitgeb, Roland Winkler, Steve Anderson | 2020-09-29 |
| 10374114 | Lateral single-photon avalanche diode and method of producing a lateral single-photon avalanche diode | Jordi Teva, Frederic Roger, Ewald Stueckler, Stefan Jessenig, Rainer Minixhofer +2 more | 2019-08-06 |
| 10340254 | Method of producing an interposer-chip-arrangement for dense packaging of chips | Jochen Kraft, Franz Schrank | 2019-07-02 |
| 10283541 | Semiconductor device comprising an aperture array and method of producing such a semiconductor device | Joerg Siegert, Franz Schrank | 2019-05-07 |
| 10256147 | Dicing method | Bernhard Stering, Franz Schrank | 2019-04-09 |
| 10217715 | Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device | Bernhard Stering, Harald Etschmaier | 2019-02-26 |
| 9947711 | Semiconductor device with surface integrated focusing element and method of producing a semiconductor device with focusing element | Rainer Minixhofer, Sara Carniello | 2018-04-17 |
| 9929035 | Method of producing a removable wafer connection and carrier for wafer support | Thomas Bodner, Joerg Siegert | 2018-03-27 |
| 9870988 | Method of producing a semiconductor device with through-substrate via covered by a solder ball | Cathal Cassidy, Franz Schrank | 2018-01-16 |
| 9818724 | Interposer-chip-arrangement for dense packaging of chips | Jochen Kraft, Franz Schrank | 2017-11-14 |
| 9773729 | Method of producing a semiconductor device with through-substrate via covered by a solder ball | Cathal Cassidy, Franz Schrank | 2017-09-26 |
| 9768131 | Method of producing a semiconductor device with protruding contacts | Jochen Kraft, Karl Rohracher | 2017-09-19 |
| 9735101 | Semiconductor device with through-substrate via covered by a solder ball | Cathal Cassidy, Franz Schrank | 2017-08-15 |
| 9684074 | Optical sensor arrangement and method of producing an optical sensor arrangement | Franz Schrank, Eugene G. Dierschke | 2017-06-20 |
| 9577001 | Integrated imaging device for infrared radiation and method of production | Hubert Enichlmair, Rainer Minixhofer | 2017-02-21 |
| 9570390 | Semiconductor device with integrated hot plate and recessed substrate and method of production | Franz Schrank | 2017-02-14 |
| 9553039 | Semiconductor device with through-substrate via covered by a solder ball and related method of production | Cathal Cassidy, Franz Schrank | 2017-01-24 |
| 9543245 | Semiconductor sensor device and method of producing a semiconductor sensor device | Franz Schrank | 2017-01-10 |
| 9443759 | Method for producing a semiconductor device comprising a conductor layer in the semiconductor body and semiconductor body | Rainer Minixhofer, Ewald Stückler, Günther Koppitsch, Jochen Kraft, Jordi Teva | 2016-09-13 |