Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211769 | Through-substrate via and method for manufacturing a through-substrate via | Georg Parteder, Stefan Jessenig | 2025-01-28 |
| 11808654 | Integrated optical transducer and method for detecting dynamic pressure changes | Goran Stojanovic, Colin Steele, Jens Hofrichter, Catalin Lazar | 2023-11-07 |
| 11764109 | Method of forming a through-substrate via and a semiconductor device comprising a through-substrate via | Georg Parteder, Stefan Jessenig, Franz Schrank, Jörg Siegert | 2023-09-19 |
| 11668636 | Particle density sensor using evanescent wave of waveguide | Georg Röhrer, Fernando Jesus CASTANO SANCHEZ, Anderson PIRES SINGULANI, Paul Maierhofer | 2023-06-06 |
| 11474039 | Chemical sensing device using fluorescent sensing material | Martin Sagmeister, Victor Sidorov | 2022-10-18 |
| 11367672 | Semiconductor device with through-substrate via | Georg Parteder, Anderson PIRES SINGULANI, Raffaele Coppeta, Franz Schrank | 2022-06-21 |
| 11355386 | Method for manufacturing a semiconductor device and semiconductor device | Georg Parteder, Raffaele Coppeta | 2022-06-07 |
| 11127656 | Crack-resistant semiconductor devices | Georg Parteder, Anderson Singulani, Raffaele Coppeta, Franz Schrank | 2021-09-21 |
| 10684412 | Semiconductor device with photonic and electronic functionality and method for manufacturing a semiconductor device | Joerg Siegert | 2020-06-16 |
| 10468541 | Semiconductor device with through-substrate via and corresponding method of manufacture | Franz Schrank, Sara Carniello, Hubert Enichlmair, Bernhard Loeffler, Rainer Holzhaider | 2019-11-05 |
| 10340254 | Method of producing an interposer-chip-arrangement for dense packaging of chips | Martin Schrems, Franz Schrank | 2019-07-02 |
| 10243017 | Sensor chip stack and method of producing a sensor chip stack | Georg Parteder, Franz Schrank, Thomas Troxler, Andreas Fitzi | 2019-03-26 |
| 9995894 | Semiconductor device with optical and electrical vias | Karl Rohracher, Jordi Teva | 2018-06-12 |
| 9818724 | Interposer-chip-arrangement for dense packaging of chips | Martin Schrems, Franz Schrank | 2017-11-14 |
| 9768131 | Method of producing a semiconductor device with protruding contacts | Karl Rohracher, Martin Schrems | 2017-09-19 |
| 9753218 | Semiconductor device with integrated mirror and method of producing a semiconductor device with integrated mirror | Joerg Siegert, Ewald Stueckler | 2017-09-05 |
| 9443759 | Method for producing a semiconductor device comprising a conductor layer in the semiconductor body and semiconductor body | Rainer Minixhofer, Ewald Stückler, Martin Schrems, Günther Koppitsch, Jordi Teva | 2016-09-13 |
| 9245843 | Semiconductor device with internal substrate contact and method of production | Jordi Teva, Cathal Cassidy, Günther Koppitsch | 2016-01-26 |
| 9018726 | Photodiode and production method | Ingrid Jonak-Auer, Rainer Minixhofer, Jordi Teva, Herbert Truppe | 2015-04-28 |
| 8969193 | Method of producing a semiconductor device having an interconnect through the substrate | Franz Schrank, Martin Schrems | 2015-03-03 |
| 8884442 | Method for producing a semiconductor component with a through-contact and semiconductor component with through-contact | Stefan Jessenig, Günther Koppitsch, Franz Schrank, Jordi Teva, Bernhard Löffler +1 more | 2014-11-11 |
| 8796743 | Light-sensitive component | Hubert Enichlmair, Georg Röhrer | 2014-08-05 |
| 8658534 | Method for producing a semiconductor component, and semiconductor component | Franz Schrank, Günther Koppitsch, Michael Beutl, Sara Carniello | 2014-02-25 |
| 8633107 | Method of producing a semiconductor device and semiconductor device having a through-wafer interconnect | Jordi Teva | 2014-01-21 |
| 8623762 | Semiconductor device and a method for making the semiconductor device | Franz Schrank | 2014-01-07 |