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Method of manufacturing a semiconductor transducer device with multilayer diaphragm and semiconductor transducer device with multilayer diaphragm |
Alessandro Faes, Willem Frederik Adrianus Besling, Remco Henricus Wilhelmus Pijnenburg |
2025-01-07 |
| 11946822 |
Semiconductor transducer device with multilayer diaphragm and method of manufacturing a semiconductor transducer device with multilayer diaphragm |
Alessandro Faes, Willem Frederik Adrianus Besling, Remco Henricus Wilhelmus Pijnenburg |
2024-04-02 |
| 11878906 |
Method for manufacturing an integrated MEMS transducer device and integrated MEMS transducer device |
Kailash Vijayakumar, Remco Henricus Wilhelmus Pijnenburg, Willem Frederik Adrianus Besling, Sophie Guillemin |
2024-01-23 |
| 11764109 |
Method of forming a through-substrate via and a semiconductor device comprising a through-substrate via |
Jochen Kraft, Georg Parteder, Stefan Jessenig, Franz Schrank |
2023-09-19 |
| 11585711 |
Capacitive pressure with Ti electrode |
Willem Frederik Adrianus Besling, Remco Henricus Wilhelmus Pijnenburg, Kailash Vijayakumar, Alessandro Faes |
2023-02-21 |
| 11492251 |
Method for manufacturing an integrated MEMS transducer device and integrated MEMS transducer device |
Kailash Vijayakumar, Remco Henricus Wilhelmus Pijnenburg, Willem Frederik Adrianus Besling, Sophie Guillemin |
2022-11-08 |
| 11248976 |
Capacitive pressure sensors and other devices having a suspended membrane and having rounded corners at an anchor edge |
Willem Frederik Adrianus Besling, Casper van der Avoort, Remco Henricus Wilhelmus Pijnenburg, Olaf Wunnicke, Alessandro Faes |
2022-02-15 |
| 9105645 |
Method for producing thin semiconductor components |
Bernhard Stering, Bernhard Löffler |
2015-08-11 |
| 8884442 |
Method for producing a semiconductor component with a through-contact and semiconductor component with through-contact |
Jochen Kraft, Stefan Jessenig, Günther Koppitsch, Franz Schrank, Jordi Teva +1 more |
2014-11-11 |