Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978507 | Method for manufacturing optical sensor arrangements and housing for an optical sensor | Sonja Koenig, Harald Etschmaier | 2021-04-13 |
| 10256147 | Dicing method | Martin Schrems, Franz Schrank | 2019-04-09 |
| 10217715 | Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device | Martin Schrems, Harald Etschmaier | 2019-02-26 |
| 9961777 | Method for cutting a carrier for electrical components | — | 2018-05-01 |
| 9917012 | Dicing method for wafer-level packaging and semiconductor chip with dicing structure adapted for wafer-level packaging | — | 2018-03-13 |
| 9842946 | Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method | Rainer Minixhofer, Harald Etschmaier | 2017-12-12 |
| 9105645 | Method for producing thin semiconductor components | Jörg Siegert, Bernhard Löffler | 2015-08-11 |