| 10978507 |
Method for manufacturing optical sensor arrangements and housing for an optical sensor |
Sonja Koenig, Harald Etschmaier |
2021-04-13 |
| 10256147 |
Dicing method |
Martin Schrems, Franz Schrank |
2019-04-09 |
| 10217715 |
Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device |
Martin Schrems, Harald Etschmaier |
2019-02-26 |
| 9961777 |
Method for cutting a carrier for electrical components |
— |
2018-05-01 |
| 9917012 |
Dicing method for wafer-level packaging and semiconductor chip with dicing structure adapted for wafer-level packaging |
— |
2018-03-13 |
| 9842946 |
Semiconductor device comprising an emitter of radiation and a photosensor and appertaining production method |
Rainer Minixhofer, Harald Etschmaier |
2017-12-12 |
| 9105645 |
Method for producing thin semiconductor components |
Jörg Siegert, Bernhard Löffler |
2015-08-11 |