Issued Patents All Time
Showing 1–25 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027653 | LED/LD illumination device with separate luminophore configuration, and method for producing same | Steffen Riemer, Patrick Uitz, Wilhelm Brugger, Thomas Irran | 2024-07-02 |
| 11764109 | Method of forming a through-substrate via and a semiconductor device comprising a through-substrate via | Jochen Kraft, Georg Parteder, Stefan Jessenig, Jörg Siegert | 2023-09-19 |
| 11460181 | LED module and use of the LED module | Thomas Feichtinger | 2022-10-04 |
| 11367672 | Semiconductor device with through-substrate via | Jochen Kraft, Georg Parteder, Anderson PIRES SINGULANI, Raffaele Coppeta | 2022-06-21 |
| 11313749 | Pressure sensor device and method for forming a pressure sensor device | Joerg Siegert, Willem Frederik Adrianus Besling, Coenraad Cornelis Tak, Martin Schrems | 2022-04-26 |
| 11271134 | Method for manufacturing an optical sensor and optical sensor | Gregor Toschkoff, Thomas Bodner, Miklos Labodi, Joerg Siegert, Martin Schrems | 2022-03-08 |
| 11139207 | Method for manufacturing a semiconductor device and semiconductor device | Thomas Bodner, Stefan Jessenig | 2021-10-05 |
| 11127656 | Crack-resistant semiconductor devices | Jochen Kraft, Georg Parteder, Anderson Singulani, Raffaele Coppeta | 2021-09-21 |
| 11107848 | Semiconductor device for detection of radiation and method of producing a semiconductor device for detection of radiation | Hubert Enichlmair, Joerg Siegert | 2021-08-31 |
| 10943936 | Method of producing an optical sensor at wafer-level and optical sensor | Gregor Toschkoff, Thomas Bodner | 2021-03-09 |
| 10847664 | Optical package and method of producing an optical package | David Mehrl, Thomas Bodner, Gregor Toschkoff, Harald Etschmaier | 2020-11-24 |
| 10734534 | Method of producing an optical sensor at wafer-level and optical sensor | Harald Etschmaier, Gregor Toschkoff, Thomas Bodner | 2020-08-04 |
| 10644047 | Optoelectronic device with a refractive element and a method of producing such an optoelectronic device | Jens Hofrichter, Joerg Siegert | 2020-05-05 |
| 10468541 | Semiconductor device with through-substrate via and corresponding method of manufacture | Sara Carniello, Hubert Enichlmair, Jochen Kraft, Bernhard Loeffler, Rainer Holzhaider | 2019-11-05 |
| 10340254 | Method of producing an interposer-chip-arrangement for dense packaging of chips | Jochen Kraft, Martin Schrems | 2019-07-02 |
| 10332931 | Semiconductor device for wafer-scale integration | Cathal Cassidy, Joerg Siegert | 2019-06-25 |
| 10283541 | Semiconductor device comprising an aperture array and method of producing such a semiconductor device | Joerg Siegert, Martin Schrems | 2019-05-07 |
| 10256147 | Dicing method | Martin Schrems, Bernhard Stering | 2019-04-09 |
| 10243017 | Sensor chip stack and method of producing a sensor chip stack | Georg Parteder, Jochen Kraft, Thomas Troxler, Andreas Fitzi | 2019-03-26 |
| 10084004 | Semiconductor device for optical applications and method of producing such a semiconductor device | Hubert Enichlmair | 2018-09-25 |
| 9870988 | Method of producing a semiconductor device with through-substrate via covered by a solder ball | Cathal Cassidy, Martin Schrems | 2018-01-16 |
| 9818724 | Interposer-chip-arrangement for dense packaging of chips | Jochen Kraft, Martin Schrems | 2017-11-14 |
| 9773729 | Method of producing a semiconductor device with through-substrate via covered by a solder ball | Cathal Cassidy, Martin Schrems | 2017-09-26 |
| 9735101 | Semiconductor device with through-substrate via covered by a solder ball | Cathal Cassidy, Martin Schrems | 2017-08-15 |
| 9684074 | Optical sensor arrangement and method of producing an optical sensor arrangement | Eugene G. Dierschke, Martin Schrems | 2017-06-20 |