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USPTO Patent Rankings Data through Dec 31, 2025
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Thomas Bodner — 11 Patents

AAAms Ag: 11 patents #25 of 335Top 8%
Seiersberg, AT: #2 of 17 inventorsTop 15%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Thomas Bodner has been granted 11 US patents while listed as an inventor at Ams Ag. The first was granted in 2017 and the most recent in July 2025. Thomas Bodner ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Thomas Bodner in Seiersberg, AT.

Patents per Year

Patents granted per year, 2017 to 2025Bar chart with a peak of 2 patents in 2018.peak 22017: 1 patents20172018: 2 patents20182020: 2 patents20202021: 2 patents20212022: 1 patents20222023: 1 patents20232024: 1 patents20242025: 1 patents2025

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
12362230 Method of producing a semiconductor body with a trench, semiconductor body with at least one trench and semiconductor device Georg Parteder 2025-07-15
12100644 Semiconductor device with through-substrate via and method of manufacturing a semiconductor device with through-substrate via Bernhard Loeffler, Joerg Siegert 2024-09-24
11675049 Method for fabricating a plurality of time-of-flight sensor devices Harald Etschmaier 2023-06-13
11271134 Method for manufacturing an optical sensor and optical sensor Gregor Toschkoff, Franz Schrank, Miklos Labodi, Joerg Siegert, Martin Schrems 2022-03-08
11139207 Method for manufacturing a semiconductor device and semiconductor device Stefan Jessenig, Franz Schrank 2021-10-05
10943936 Method of producing an optical sensor at wafer-level and optical sensor Gregor Toschkoff, Franz Schrank 2021-03-09
10847664 Optical package and method of producing an optical package David Mehrl, Gregor Toschkoff, Harald Etschmaier, Franz Schrank 2020-11-24
10734534 Method of producing an optical sensor at wafer-level and optical sensor Harald Etschmaier, Gregor Toschkoff, Franz Schrank 2020-08-04
9991177 Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component Helene Gehles, Joerg Siegert 2018-06-05
9929035 Method of producing a removable wafer connection and carrier for wafer support Joerg Siegert, Martin Schrems 2018-03-27
9852955 Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component Helene Gehles, Joerg Siegert 2017-12-26

Frequent Collaborators

Franz Schrank5 shared
Joerg Siegert5 shared
Gregor Toschkoff4 shared
Harald Etschmaier3 shared
Helene Gehles2 shared
Martin Schrems2 shared

Nearby-Ranked Inventors

Ya-Ching Chang11
Hermann Lubbert11
Alexander WAITE11
Mehrad Mehr11
Matthew J. Purdey11
Nishtha Madaan11
Ian C. Richards11
Chad Huffman11
Lifeng Fan11