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Method of producing a semiconductor body with a trench, semiconductor body with at least one trench and semiconductor device |
Georg Parteder |
2025-07-15 |
| 12100644 |
Semiconductor device with through-substrate via and method of manufacturing a semiconductor device with through-substrate via |
Bernhard Loeffler, Joerg Siegert |
2024-09-24 |
| 11675049 |
Method for fabricating a plurality of time-of-flight sensor devices |
Harald Etschmaier |
2023-06-13 |
| 11271134 |
Method for manufacturing an optical sensor and optical sensor |
Gregor Toschkoff, Franz Schrank, Miklos Labodi, Joerg Siegert, Martin Schrems |
2022-03-08 |
| 11139207 |
Method for manufacturing a semiconductor device and semiconductor device |
Stefan Jessenig, Franz Schrank |
2021-10-05 |
| 10943936 |
Method of producing an optical sensor at wafer-level and optical sensor |
Gregor Toschkoff, Franz Schrank |
2021-03-09 |
| 10847664 |
Optical package and method of producing an optical package |
David Mehrl, Gregor Toschkoff, Harald Etschmaier, Franz Schrank |
2020-11-24 |
| 10734534 |
Method of producing an optical sensor at wafer-level and optical sensor |
Harald Etschmaier, Gregor Toschkoff, Franz Schrank |
2020-08-04 |
| 9991177 |
Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component |
Helene Gehles, Joerg Siegert |
2018-06-05 |
| 9929035 |
Method of producing a removable wafer connection and carrier for wafer support |
Joerg Siegert, Martin Schrems |
2018-03-27 |
| 9852955 |
Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component |
Helene Gehles, Joerg Siegert |
2017-12-26 |