Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362230 | Method of producing a semiconductor body with a trench, semiconductor body with at least one trench and semiconductor device | Georg Parteder | 2025-07-15 |
| 12100644 | Semiconductor device with through-substrate via and method of manufacturing a semiconductor device with through-substrate via | Bernhard Loeffler, Joerg Siegert | 2024-09-24 |
| 11675049 | Method for fabricating a plurality of time-of-flight sensor devices | Harald Etschmaier | 2023-06-13 |
| 11271134 | Method for manufacturing an optical sensor and optical sensor | Gregor Toschkoff, Franz Schrank, Miklos Labodi, Joerg Siegert, Martin Schrems | 2022-03-08 |
| 11139207 | Method for manufacturing a semiconductor device and semiconductor device | Stefan Jessenig, Franz Schrank | 2021-10-05 |
| 10943936 | Method of producing an optical sensor at wafer-level and optical sensor | Gregor Toschkoff, Franz Schrank | 2021-03-09 |
| 10847664 | Optical package and method of producing an optical package | David Mehrl, Gregor Toschkoff, Harald Etschmaier, Franz Schrank | 2020-11-24 |
| 10734534 | Method of producing an optical sensor at wafer-level and optical sensor | Harald Etschmaier, Gregor Toschkoff, Franz Schrank | 2020-08-04 |
| 9991177 | Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component | Helene Gehles, Joerg Siegert | 2018-06-05 |
| 9929035 | Method of producing a removable wafer connection and carrier for wafer support | Joerg Siegert, Martin Schrems | 2018-03-27 |
| 9852955 | Method and arrangement for analyzing a semiconductor element and method for manufacturing a semiconductor component | Helene Gehles, Joerg Siegert | 2017-12-26 |