| 12362230 |
Method of producing a semiconductor body with a trench, semiconductor body with at least one trench and semiconductor device |
Thomas Bodner |
2025-07-15 |
| 12211769 |
Through-substrate via and method for manufacturing a through-substrate via |
Jochen Kraft, Stefan Jessenig |
2025-01-28 |
| 11764109 |
Method of forming a through-substrate via and a semiconductor device comprising a through-substrate via |
Jochen Kraft, Stefan Jessenig, Franz Schrank, Jörg Siegert |
2023-09-19 |
| 11404352 |
Semiconductor device with through-substrate via and its method of manufacture |
Victor Sidorov, Stefan Jessenig |
2022-08-02 |
| 11367672 |
Semiconductor device with through-substrate via |
Jochen Kraft, Anderson PIRES SINGULANI, Raffaele Coppeta, Franz Schrank |
2022-06-21 |
| 11355386 |
Method for manufacturing a semiconductor device and semiconductor device |
Jochen Kraft, Raffaele Coppeta |
2022-06-07 |
| 11127656 |
Crack-resistant semiconductor devices |
Jochen Kraft, Anderson Singulani, Raffaele Coppeta, Franz Schrank |
2021-09-21 |
| 10243017 |
Sensor chip stack and method of producing a sensor chip stack |
Jochen Kraft, Franz Schrank, Thomas Troxler, Andreas Fitzi |
2019-03-26 |