Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10967450 | Slicing SiC material by wire electrical discharge machining | Francisco Javier Santos Rodriguez, Roland Rupp, Markus Heinrici, Karin Delalut, Claudia Friza | 2021-04-06 |
| 10643860 | Methods of thinning and structuring semiconductor wafers by electrical discharge machining | Francisco Javier Santos Rodriguez | 2020-05-05 |