Issued Patents All Time
Showing 1–25 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12356700 | Method for splitting semiconductor wafers | Francisco Javier Santos Rodriguez, Hans-Joachim Schulze, Marko Swoboda | 2025-07-08 |
| 12286611 | Tissue culture vessel for preparation of compressed hydrogel skin grafts and related methods and systems | Claude Nicolas Holenstein, Vincent Ronfard, Anna-Lena Dittrich, Siegfried Graf, Krzysztof Krasnopolski +5 more | 2025-04-29 |
| 12211702 | Solid body and multi-component arrangement | Wolfram Drescher, Marko Swoboda, Ralf Rieske, Jan Richter | 2025-01-28 |
| 12159805 | Method for producing wafers with modification lines of defined orientation | Marko Swoboda, Ralf Rieske, Jan Richter | 2024-12-03 |
| 12151314 | Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack | Marko Swoboda, Ralf Rieske, Jan Richter | 2024-11-26 |
| 12097641 | Method for forming a crack in an edge region of a donor substrate | Marko Swoboda, Franz Schilling, Jan Richter | 2024-09-24 |
| 12030216 | Method for separating wafers from donor substrates | Marko Swoboda, Ralf Rieske, Albrecht Ullrich, Jan Richter | 2024-07-09 |
| 11996331 | Method for separating a solid body | Jan Richter | 2024-05-28 |
| 11908652 | Signaling device, an electrical fuse apparatus and a device comprising the electrical fuse apparatus | Rolf Nussbaumer, Bruno Zemp, Thomas Burch, Stephan Bitterli, Markus Beer +1 more | 2024-02-20 |
| 11869810 | Method for reducing the thickness of solid-state layers provided with components | Marko Swoboda, Ralf Rieske, Jan Richter | 2024-01-09 |
| 11833617 | Splitting of a solid using conversion of material | Jan Richter, Ralf Rieske | 2023-12-05 |
| 11787083 | Production facility for separating wafers from donor substrates | Marko Swoboda, Ralf Rieske, Albrecht Ullrich, Jan Richter | 2023-10-17 |
| 11699616 | Method for producing a layer of solid material | Wolfram Drescher, Jan Richter | 2023-07-11 |
| 11527441 | Method for producing a detachment area in a solid body | Jan Richter | 2022-12-13 |
| 11407066 | Splitting of a solid using conversion of material | Jan Richter, Ralf Rieske | 2022-08-09 |
| 11309191 | Method for modifying substrates based on crystal lattice dislocation density | Jan Richter, Ralf Rieske, Marko Swoboda, Albrecht Ullrich | 2022-04-19 |
| 11081393 | Method for splitting semiconductor wafers | Francisco Javier Santos Rodriguez, Hans-Joachim Schulze, Marko Swoboda | 2021-08-03 |
| 11059202 | Method and device for producing planar modifications in solid bodies | Ralf Rieske, Christoph Guenther, Jan Richter, Marko Swoboda | 2021-07-13 |
| 11014199 | Method of modifying a solid using laser light | — | 2021-05-25 |
| 11004723 | Wafer production method | Wolfram Drescher, Jan Richter | 2021-05-11 |
| 10994442 | Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam | Marko Swoboda, Franz Schilling, Jan Richter | 2021-05-04 |
| 10978311 | Method for thinning solid body layers provided with components | Wolfram Drescher, Marko Swoboda, Ralf Rieske, Jan Richter | 2021-04-13 |
| 10960574 | Combined wafer production method with a receiving layer having holes | Jan Richter, Anas Ajaj | 2021-03-30 |
| 10930560 | Laser-based separation method | Jan Richter | 2021-02-23 |
| 10898708 | System and method for applying pulsed electromagnetic fields | Alfredo Franco-Obregon, Chuen Neng Lee, Wee Chuan Melvin Loh, Jürg Hans Fröhlich, Tien Min David Lai | 2021-01-26 |