Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10960574 | Combined wafer production method with a receiving layer having holes | Jan Richter, Christian Beyer | 2021-03-30 |
| 10707068 | Combined wafer production method with a multi-component receiving layer | Jan Richter, Christian Beyer | 2020-07-07 |