Issued Patents All Time
Showing 1–25 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211702 | Solid body and multi-component arrangement | Wolfram Drescher, Marko Swoboda, Ralf Rieske, Christian Beyer | 2025-01-28 |
| 12190162 | Optimized allocation of resources to nodes of an automation system based on monte carlo simulation | Andrés Botero Halblaub | 2025-01-07 |
| 12159805 | Method for producing wafers with modification lines of defined orientation | Marko Swoboda, Ralf Rieske, Christian Beyer | 2024-12-03 |
| 12151314 | Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack | Marko Swoboda, Ralf Rieske, Christian Beyer | 2024-11-26 |
| 12097641 | Method for forming a crack in an edge region of a donor substrate | Marko Swoboda, Christian Beyer, Franz Schilling | 2024-09-24 |
| 12030216 | Method for separating wafers from donor substrates | Marko Swoboda, Christian Beyer, Ralf Rieske, Albrecht Ullrich | 2024-07-09 |
| 11996331 | Method for separating a solid body | Christian Beyer | 2024-05-28 |
| 11869810 | Method for reducing the thickness of solid-state layers provided with components | Marko Swoboda, Ralf Rieske, Christian Beyer | 2024-01-09 |
| 11833617 | Splitting of a solid using conversion of material | Christian Beyer, Ralf Rieske | 2023-12-05 |
| 11822307 | Laser conditioning of solid bodies using prior knowledge from previous machining steps | Marko Swoboda, Ralf Rieske, Franz Schilling | 2023-11-21 |
| 11787083 | Production facility for separating wafers from donor substrates | Marko Swoboda, Christian Beyer, Ralf Rieske, Albrecht Ullrich | 2023-10-17 |
| 11786995 | Nonplanar wafer and method for producing a nonplanar wafer | — | 2023-10-17 |
| 11772201 | Method for separating solid body layers from composite structures made of SiC and a metallic coating or electrical components | Marko Swoboda | 2023-10-03 |
| 11712749 | Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices | Ralf Rieske, Alexander Binter, Wolfgang Diewald, Bernhard Goller, Heimo Graf +4 more | 2023-08-01 |
| 11699616 | Method for producing a layer of solid material | Wolfram Drescher, Christian Beyer | 2023-07-11 |
| 11664277 | Method for thinning solid-body layers provided with components | Ralf Rieske, Marko Swoboda | 2023-05-30 |
| 11527441 | Method for producing a detachment area in a solid body | Christian Beyer | 2022-12-13 |
| 11518066 | Method of treating a solid layer bonded to a carrier substrate | Franz Schilling, Wolfram Drescher | 2022-12-06 |
| 11407066 | Splitting of a solid using conversion of material | Christian Beyer, Ralf Rieske | 2022-08-09 |
| 11309191 | Method for modifying substrates based on crystal lattice dislocation density | Christian Beyer, Ralf Rieske, Marko Swoboda, Albrecht Ullrich | 2022-04-19 |
| 11201081 | Method for separating thin layers of solid material from a solid body | Wolfram Drescher | 2021-12-14 |
| 11130200 | Combined laser treatment of a solid body to be split | Ralf Rieske, Marko Swoboda | 2021-09-28 |
| 11059202 | Method and device for producing planar modifications in solid bodies | Ralf Rieske, Christian Beyer, Christoph Guenther, Marko Swoboda | 2021-07-13 |
| 11004723 | Wafer production method | Wolfram Drescher, Christian Beyer | 2021-05-11 |
| 10994442 | Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam | Marko Swoboda, Christian Beyer, Franz Schilling | 2021-05-04 |