Marko Swoboda — 24 Patents at Siltectra Gmbh

Marko Swoboda has been granted 24 US patents while listed as an inventor at Siltectra Gmbh. The first was granted in 2019 and the most recent in July 2025. Marko Swoboda ranks #168,038 of 4,157,543 US inventors in our database (top 4.0%). Patent records list Marko Swoboda in Dresden, DE.

Issued Patents All Time

Showing 1–24 of 24 patents

Patent #	Title	Co-Inventors	Date
12356700	Method for splitting semiconductor wafers	Christian Beyer, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze	2025-07-08
12211702	Solid body and multi-component arrangement	Wolfram Drescher, Ralf Rieske, Christian Beyer, Jan Richter	2025-01-28
12159805	Method for producing wafers with modification lines of defined orientation	Ralf Rieske, Christian Beyer, Jan Richter	2024-12-03
12151314	Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack	Ralf Rieske, Christian Beyer, Jan Richter	2024-11-26
12107017	Method and apparatus for producing at least one modification in a solid body	Ralf Rieske, Albrecht Ullrich	2024-10-01
12097641	Method for forming a crack in an edge region of a donor substrate	Christian Beyer, Franz Schilling, Jan Richter	2024-09-24
12030216	Method for separating wafers from donor substrates	Christian Beyer, Ralf Rieske, Albrecht Ullrich, Jan Richter	2024-07-09
11869810	Method for reducing the thickness of solid-state layers provided with components	Ralf Rieske, Christian Beyer, Jan Richter	2024-01-09
11822307	Laser conditioning of solid bodies using prior knowledge from previous machining steps	Ralf Rieske, Jan Richter, Franz Schilling	2023-11-21
11787083	Production facility for separating wafers from donor substrates	Christian Beyer, Ralf Rieske, Albrecht Ullrich, Jan Richter	2023-10-17
11772201	Method for separating solid body layers from composite structures made of SiC and a metallic coating or electrical components	Jan Richter	2023-10-03
11712749	Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices	Ralf Rieske, Alexander Binter, Wolfgang Diewald, Bernhard Goller, Heimo Graf +4 more	2023-08-01
11664277	Method for thinning solid-body layers provided with components	Ralf Rieske, Jan Richter	2023-05-30
11557506	Methods for processing a semiconductor substrate	Werner Schustereder, Alexander Breymesser, Mihai Draghici, Tobias Franz Wolfgang Hoechbauer, Wolfgang Lehnert +1 more	2023-01-17
11551981	Method and apparatus for producing at least one modification in a solid body	Ralf Rieske, Albrecht Ullrich	2023-01-10
11309191	Method for modifying substrates based on crystal lattice dislocation density	Christian Beyer, Jan Richter, Ralf Rieske, Albrecht Ullrich	2022-04-19
11130200	Combined laser treatment of a solid body to be split	Ralf Rieske, Jan Richter	2021-09-28
11081393	Method for splitting semiconductor wafers	Christian Beyer, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze	2021-08-03
11059202	Method and device for producing planar modifications in solid bodies	Ralf Rieske, Christian Beyer, Christoph Guenther, Jan Richter	2021-07-13
10994442	Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam	Christian Beyer, Franz Schilling, Jan Richter	2021-05-04
10978311	Method for thinning solid body layers provided with components	Wolfram Drescher, Ralf Rieske, Christian Beyer, Jan Richter	2021-04-13
10858495	Polymer hybrid material for use in a splitting method	Christian Beyer, Jan Richter	2020-12-08
10676386	Method for guiding a crack in the peripheral region of a donor substrate	Christian Beyer, Franz Schilling, Jan Richter	2020-06-09
10280107	Method for guiding a crack in the peripheral region of a donor substrate	Christian Beyer, Franz Schilling, Jan Richter	2019-05-07

Marko Swoboda — 24 Patents

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