| 12356700 |
Method for splitting semiconductor wafers |
Christian Beyer, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze |
2025-07-08 |
| 12211702 |
Solid body and multi-component arrangement |
Wolfram Drescher, Ralf Rieske, Christian Beyer, Jan Richter |
2025-01-28 |
| 12159805 |
Method for producing wafers with modification lines of defined orientation |
Ralf Rieske, Christian Beyer, Jan Richter |
2024-12-03 |
| 12151314 |
Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack |
Ralf Rieske, Christian Beyer, Jan Richter |
2024-11-26 |
| 12107017 |
Method and apparatus for producing at least one modification in a solid body |
Ralf Rieske, Albrecht Ullrich |
2024-10-01 |
| 12097641 |
Method for forming a crack in an edge region of a donor substrate |
Christian Beyer, Franz Schilling, Jan Richter |
2024-09-24 |
| 12030216 |
Method for separating wafers from donor substrates |
Christian Beyer, Ralf Rieske, Albrecht Ullrich, Jan Richter |
2024-07-09 |
| 11869810 |
Method for reducing the thickness of solid-state layers provided with components |
Ralf Rieske, Christian Beyer, Jan Richter |
2024-01-09 |
| 11822307 |
Laser conditioning of solid bodies using prior knowledge from previous machining steps |
Ralf Rieske, Jan Richter, Franz Schilling |
2023-11-21 |
| 11787083 |
Production facility for separating wafers from donor substrates |
Christian Beyer, Ralf Rieske, Albrecht Ullrich, Jan Richter |
2023-10-17 |
| 11772201 |
Method for separating solid body layers from composite structures made of SiC and a metallic coating or electrical components |
Jan Richter |
2023-10-03 |
| 11712749 |
Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices |
Ralf Rieske, Alexander Binter, Wolfgang Diewald, Bernhard Goller, Heimo Graf +4 more |
2023-08-01 |
| 11664277 |
Method for thinning solid-body layers provided with components |
Ralf Rieske, Jan Richter |
2023-05-30 |
| 11557506 |
Methods for processing a semiconductor substrate |
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2023-01-17 |
| 11551981 |
Method and apparatus for producing at least one modification in a solid body |
Ralf Rieske, Albrecht Ullrich |
2023-01-10 |
| 11309191 |
Method for modifying substrates based on crystal lattice dislocation density |
Christian Beyer, Jan Richter, Ralf Rieske, Albrecht Ullrich |
2022-04-19 |
| 11130200 |
Combined laser treatment of a solid body to be split |
Ralf Rieske, Jan Richter |
2021-09-28 |
| 11081393 |
Method for splitting semiconductor wafers |
Christian Beyer, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze |
2021-08-03 |
| 11059202 |
Method and device for producing planar modifications in solid bodies |
Ralf Rieske, Christian Beyer, Christoph Guenther, Jan Richter |
2021-07-13 |
| 10994442 |
Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam |
Christian Beyer, Franz Schilling, Jan Richter |
2021-05-04 |
| 10978311 |
Method for thinning solid body layers provided with components |
Wolfram Drescher, Ralf Rieske, Christian Beyer, Jan Richter |
2021-04-13 |
| 10858495 |
Polymer hybrid material for use in a splitting method |
Christian Beyer, Jan Richter |
2020-12-08 |
| 10676386 |
Method for guiding a crack in the peripheral region of a donor substrate |
Christian Beyer, Franz Schilling, Jan Richter |
2020-06-09 |
| 10280107 |
Method for guiding a crack in the peripheral region of a donor substrate |
Christian Beyer, Franz Schilling, Jan Richter |
2019-05-07 |
