Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam

Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam

US Patent 10994442 · Granted May 4, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for splitting semiconductor wafers2025
Method for splitting semiconductor wafers2025
Tissue culture vessel for preparation of compressed hydrogel skin grafts and rel2025
Solid body and multi-component arrangement2025
Solid body and multi-component arrangement2025
Solid body and multi-component arrangement2025
Optimized allocation of resources to nodes of an automation system based on mont2025
Method for producing wafers with modification lines of defined orientation2024
Method for producing wafers with modification lines of defined orientation2024
Method for producing wafers with modification lines of defined orientation2024
Device and method for applying pressure to stress-producing layers for improved 2024
Device and method for applying pressure to stress-producing layers for improved 2024