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Method for forming a crack in an edge region of a donor substrate |
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| 11822307 |
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Marko Swoboda, Ralf Rieske, Jan Richter |
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| 11518066 |
Method of treating a solid layer bonded to a carrier substrate |
Wolfram Drescher, Jan Richter |
2022-12-06 |
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Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam |
Marko Swoboda, Christian Beyer, Jan Richter |
2021-05-04 |
| 10843380 |
Method for the material-saving production of wafers and processing of wafers |
Wolfram Drescher, Jan Richter |
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| 10676386 |
Method for guiding a crack in the peripheral region of a donor substrate |
Marko Swoboda, Christian Beyer, Jan Richter |
2020-06-09 |
| 10280107 |
Method for guiding a crack in the peripheral region of a donor substrate |
Marko Swoboda, Christian Beyer, Jan Richter |
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| 4785871 |
Manufacturing method for hollow cast product with bottom |
Shiro Nakamura, Katsuya Inoue, Friedrich Werner |
1988-11-22 |
| 4729419 |
Mold and manufacturing method for hollow cast product with bottom |
Shiro Nakamura, Katsuya Inoue, Friedrich Werner |
1988-03-08 |
| 4373126 |
Process for eliminating errors in prepositioning pieces to be manufactured by electro-erosion |
— |
1983-02-08 |