Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for producing at least one modification in a solid body

Method and apparatus for producing at least one modification in a solid body

US Patent 11551981 · Granted Jan 10, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for splitting semiconductor wafers2025
Solid body and multi-component arrangement2025
Solid body and multi-component arrangement2025
Method for producing wafers with modification lines of defined orientation2024
Method for producing wafers with modification lines of defined orientation2024
Device and method for applying pressure to stress-producing layers for improved 2024
Device and method for applying pressure to stress-producing layers for improved 2024
Method and apparatus for producing at least one modification in a solid body2024
Method and apparatus for producing at least one modification in a solid body2024
Method and apparatus for producing at least one modification in a solid body2024
Method for forming a crack in an edge region of a donor substrate2024
Method for separating wafers from donor substrates2024