Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11251266 | Power semiconductor device and method of processing a power semiconductor device | Philip Christoph Brandt, Manfred Pfaffenlehner, Frank Pfirsch, Steffen Schmidt, Frank Umbach | 2022-02-15 |
| 11239384 | Semiconductor wafers and semiconductor devices with barrier layer and methods of manufacturing | Roland Rupp, Hans-Joachim Schulze | 2022-02-01 |
| 11211459 | Semiconductor device and method of manufacturing a semiconductor device | Andre Brockmeier, Guenter Denifl, Ronny Kern, Michael Knabl, Matteo Piccin | 2021-12-28 |
| 11149351 | Apparatus and method for chemical vapor deposition process for semiconductor substrates | Matthias Kuenle, Johannes Baumgartl, Manfred Engelhardt, Christian Illemann, Olaf Storbeck | 2021-10-19 |
| 11148943 | Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass pieces | Alexander Breymesser, Andre Brockmeier, Carsten von Koblinski | 2021-10-19 |
| 11139375 | Semiconductor device and method of manufacturing a semiconductor device | Carsten Schaeffer, Alexander Breymesser, Bernhard Goller, Ronny Kern, Matteo Piccin +1 more | 2021-10-05 |
| 11107732 | Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers | Guenter Denifl, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Wolfgang Lehnert, Roland Rupp +1 more | 2021-08-31 |
| 11094779 | Semiconductor device having an edge termination region comprising a first edge termination region of a second conductivity type adjacent to a second edge termination region of a first conductivity type | Philip Christoph Brandt, Andre Rainer Stegner, Frank Pfirsch, Hans-Joachim Schulze, Manfred Pfaffenlehner +1 more | 2021-08-17 |
| 11081393 | Method for splitting semiconductor wafers | Christian Beyer, Hans-Joachim Schulze, Marko Swoboda | 2021-08-03 |
| 11081382 | Method for processing a substrate assembly and wafer composite structure | Peter Irsigler | 2021-08-03 |
| 11046577 | Method for processing a monocrystalline substrate and micromechanical structure | Andre Brockmeier, Roland Rupp | 2021-06-29 |
| 11031483 | Forming semiconductor devices in silicon carbide | Hans-Joachim Schulze, Roland Rupp | 2021-06-08 |
| 10978418 | Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2021-04-13 |
| 10967450 | Slicing SiC material by wire electrical discharge machining | Nirdesh Ojha, Roland Rupp, Markus Heinrici, Karin Delalut, Claudia Friza | 2021-04-06 |
| 10854739 | Method for producing IGBT with dV/dt controllability | Antonio Vellei, Markus Beninger-Bina, Matteo Dainese, Christian Jaeger, Johannes Georg Laven +1 more | 2020-12-01 |
| 10840362 | IGBT with dV/dt controllability | Alexander Philippou, Markus Bina, Matteo Dainese, Christian Jaeger, Johannes Georg Laven +3 more | 2020-11-17 |
| 10833218 | Semiconductor wafers and semiconductor devices with barrier layer and methods of manufacturing | Roland Rupp, Hans-Joachim Schulze | 2020-11-10 |
| 10796914 | Method for processing a wafer, and layer stack | — | 2020-10-06 |
| 10777444 | Wafer arrangement and method for processing a wafer | Gerald Lackner, Josef Unterweger | 2020-09-15 |
| 10763151 | Wafer carrier, method for manufacturing the same and method for carrying a wafer | Roland Rupp, Ronny Kern, Josef Unterweger | 2020-09-01 |
| 10749216 | Battery, integrated circuit and method of manufacturing a battery | Ravi Keshav Joshi, Alexander Breymesser, Bernhard Goller, Kamil Karlovsky, Peter Zorn | 2020-08-18 |
| 10699934 | Substrate carrier, a processing arrangement and a method | Roland Rupp, Ronny Kern, Josef Unterweger | 2020-06-30 |
| 10665687 | Method for processing a semiconductor device and semiconductor device | Hans-Joachim Schulze, Andreas Haertl, Andre Rainer Stegner, Daniel Schloegl | 2020-05-26 |
| 10643897 | Method of forming a semiconductor device | Roland Rupp, Hans-Joachim Schulze | 2020-05-05 |
| 10643860 | Methods of thinning and structuring semiconductor wafers by electrical discharge machining | Nirdesh Ojha | 2020-05-05 |