Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7791182 | Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing | Wae Chet Yong, Stanley Job Doraisamy, Tien Lai Tan | 2010-09-07 |