Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379046 | Module comprising a semiconductor chip | Ralf Otremba, Xaver Schloegel, Chee Soon Law | 2016-06-28 |
| 9123526 | Module comprising a semiconductor chip | Ralf Otremba, Xaver Schloegel, Chee Soon Law | 2015-09-01 |
| 8633102 | Module comprising a semiconductor chip | Ralf Otremba, Xaver Schloegel, Chee Soon Law | 2014-01-21 |
| 8377753 | Method of fabricating a semiconductor device having a resin with warpage compensated structures | Chai Wei Heng, Wae Chet Yong, Stanley Job Doraisamy, Gerhard Deml | 2013-02-19 |
| 8237268 | Module comprising a semiconductor chip | Ralf Otremba, Xaver Schloegel, Chee Soon Law | 2012-08-07 |
| 8207601 | Electronic component and a method of fabricating an electronic component | Chai Wei Heng, Wae Chet Yong | 2012-06-26 |
| 8067841 | Semiconductor devices having a resin with warpage compensated surfaces | Chai Wei Heng, Wae Chet Yong, Stanley Job Doraisamy, Gerhard Deml | 2011-11-29 |