Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8377753 | Method of fabricating a semiconductor device having a resin with warpage compensated structures | Wae Chet Yong, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml | 2013-02-19 |
| 8207601 | Electronic component and a method of fabricating an electronic component | Khai Huat Jeffrey Low, Wae Chet Yong | 2012-06-26 |
| 8067841 | Semiconductor devices having a resin with warpage compensated surfaces | Wae Chet Yong, Stanley Job Doraisamy, Khai Huat Jeffrey Low, Gerhard Deml | 2011-11-29 |
| 7674657 | Method of manufacture of encapsulated package | Yang Hong Heng, Yong Chern Poh | 2010-03-09 |