EA

Eslam Abdelhamid

IA Infineon Technologies Austria Ag: 2 patents #458 of 1,126Top 45%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
Overall (All Time): #1,332,843 of 4,157,543Top 35%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
12315835 Pre-packaged chip, method of manufacturing a pre-packaged chip, semiconductor package and method of manufacturing a semiconductor package Petteri Palm, Thomas Gebhard, Mahadi-Ul HASSAN, Juan Sanchez, Martin Vielemeyer 2025-05-27
12101030 Multi-level inverting buck-boost converter architecture Juan Sanchez, Giuseppe Bernacchia 2024-09-24
11962249 Multi-level power converter architecture Juan Sanchez 2024-04-16