Issued Patents All Time
Showing 26–50 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532541 | Semiconductor package having a solderable contact pad formed by a load terminal bond pad of a power semiconductor die | Eung San Cho | 2022-12-20 |
| 11502012 | Semiconductor packages and methods of manufacturing thereof | Eung San Cho, Tomasz Naeve | 2022-11-15 |
| 11469164 | Space efficient and low parasitic half bridge | Robert Fehler, Eung San Cho, Danny Clavette | 2022-10-11 |
| 11444017 | Semiconductor package and method of manufacturing a semiconductor package | Sergey Yuferev, Robert Fehler | 2022-09-13 |
| 11430669 | Forming a lock structure in a semiconductor chip pad | — | 2022-08-30 |
| 11373944 | Die package and method of forming a die package | — | 2022-06-28 |
| 11348861 | Semiconductor package and method of manufacturing a semiconductor package | Sergey Yuferev, Robert Fehler | 2022-05-31 |
| 11309277 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Thorsten Scharf, Ralf Wombacher | 2022-04-19 |
| 11302610 | Semiconductor package and method of fabricating a semiconductor package | Markus Dinkel, Eung San Cho, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy | 2022-04-12 |
| 11303222 | Multiphase inverter apparatus | Tomasz Naeve, Elvir Kahrimanovic | 2022-04-12 |
| 11134572 | Circuit board structure and method for manufacturing a circuit board structure | Risto Tuominen, Antti Iihola | 2021-09-28 |
| 11071207 | Electronic module | Risto Tuominen | 2021-07-20 |
| 11043409 | Method of forming contacts to an embedded semiconductor die and related semiconductor packages | — | 2021-06-22 |
| 10903180 | Device including semiconductor chips and method for producing such device | Thorsten Scharf | 2021-01-26 |
| 10833583 | Methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski, Xaver Schloegel +1 more | 2020-11-10 |
| 10818646 | Power stage device with carrier frame for power stage module and integrated inductor | Eung San Cho | 2020-10-27 |
| 10811342 | Semiconductor package and method of manufacturing a semiconductor package | Sergey Yuferev, Robert Fehler | 2020-10-20 |
| 10765006 | Electronic module | Risto Tuominen | 2020-09-01 |
| 10734351 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Thorsten Scharf, Ralf Wombacher | 2020-08-04 |
| 10692803 | Die embedding | — | 2020-06-23 |
| 10601314 | Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski, Xaver Schloegel +1 more | 2020-03-24 |
| 10231335 | Electronic module with embedded jumper conductor | Tuomas Waris, Antti Iihola | 2019-03-12 |
| 10192849 | Semiconductor modules with semiconductor dies bonded to a metal foil | Alexander Heinrich, Holger Torwesten, Tobias Simbeck | 2019-01-29 |
| 10085345 | Electronic module | Risto Tuominen | 2018-09-25 |
| 10085347 | Manufacture of a circuit board and circuit board containing a component | Risto Tuominen, Antti Iihola | 2018-09-25 |