Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9589859 | Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Gottfried Beer, Edward Fuergut, Juergen Hoegerl, Peter Kanschat | 2017-03-07 |
| 9524951 | Semiconductor assembly comprising chip arrays | — | 2016-12-20 |
| 9214432 | Explosion-protected semiconductor module | Guido Boenig | 2015-12-15 |
| 9196510 | Semiconductor package comprising two semiconductor modules and laterally extending connectors | Juergen Hoegerl, Gottfried Beer, Magdalena Hoier | 2015-11-24 |
| 9064869 | Semiconductor module and a method for fabrication thereof by extended embedding technologies | Juergen Hoegerl, Edward Fuergut, Gottfried Beer | 2015-06-23 |
| 8981545 | Explosion-protected semiconductor module | Guido Boenig, Uwe Jansen | 2015-03-17 |
| 8963321 | Semiconductor device including cladded base plate | Andreas Lenniger, Andre Uhlemann | 2015-02-24 |
| 8587116 | Semiconductor module comprising an insert | Reinhold Bayerer | 2013-11-19 |
| 8519532 | Semiconductor device including cladded base plate | Andreas Lenniger, Andre Uhlemann | 2013-08-27 |
| 8514579 | Power semiconductor module including substrates spaced from each other | Thilo Stolze, Peter Kanschat | 2013-08-20 |
| 8319335 | Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly | Reinhold Bayerer, Thilo Stolze | 2012-11-27 |
| 8298867 | Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond | Jens Goerlich, Reinhold Bayerer | 2012-10-30 |
| 8159822 | Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module | Peter Kanschat, Thilo Stolze | 2012-04-17 |
| 8134837 | Twist-secured assembly of a power semiconductor module mountable on a heat sink | Peter Kanschat, Thilo Stolze | 2012-03-13 |
| 7821130 | Module including a rough solder joint | Reinhold Bayerer | 2010-10-26 |