Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8519547 | Chip arrangement and method for producing a chip arrangement | Joachim Mahler, Alfred Haimerl, Michael Bauer | 2013-08-27 |
| 8507080 | Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material | Joachim Mahler, Alfred Haimerl, Wolfgang Schober, Michael Bauer | 2013-08-13 |
| 8440733 | Semiconductor component and production method | Joachim Mahler, Alfred Haimerl, Michael Bauer, Wolfgang Schober | 2013-05-14 |
| 8354299 | Semiconductor component having a stack of semiconductor chips and method for producing the same | Michael Bauer, Thomas Engling, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2013-01-15 |
| 8178390 | Semiconductor component and production method | Joachim Mahler, Alfred Haimerl, Michael Bauer, Wolfgang Schober | 2012-05-15 |
| 8017438 | Semiconductor module with at least two substrates | Michael Bauer, Wolfgang Schober, Alfred Haimerl, Joachim Mahler | 2011-09-13 |
| 8013441 | Power semiconductor device in lead frame employing connecting element with conductive film | Michael Bauer, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2011-09-06 |
| 7911039 | Component arrangement comprising a carrier | Michael Bauer, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2011-03-22 |
| 7880300 | Semiconductor chip comprising a metal coating structure and associated production method | Michael Bauer, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2011-02-01 |
| 7834467 | Layer between interfaces of different components in semiconductor devices | Michael Bauer, Alfred Haimerl, Khalil Hosseini, Joachim Mahler, Wolfgang Schober | 2010-11-16 |
| 7795727 | Semiconductor module having discrete components and method for producing the same | Michael Bauer, Alfred Haimerl, Joachim Mahler | 2010-09-14 |
| 7768107 | Semiconductor component including semiconductor chip and method for producing the same | Michael Bauer, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2010-08-03 |
| 7749797 | Semiconductor device having a sensor chip, and method for producing the same | Michael Bauer, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2010-07-06 |
| 7728053 | Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing composition | Michael Bauer, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2010-06-01 |
| 7714422 | Electronic module with a semiconductor chip and a component housing and methods for producing the same | Michael Bauer, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2010-05-11 |
| 7705436 | Semiconductor device with semiconductor chip and method for producing it | Joachim Mahler, Alfred Haimerl, Michael Bauer, Wolfgang Schober | 2010-04-27 |
| 7645642 | Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite | Michael Bauer, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2010-01-12 |
| 7629660 | Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof | Michael Bauer, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2009-12-08 |
| 7589403 | Lead structure for a semiconductor component and method for producing the same | Michael Bauer, Wolfgang Schober, Alfred Haimerl, Joachim Mahler | 2009-09-15 |
| 7464603 | Sensor component with a cavity housing and a sensor chip and method for producing the same | Michael Bauer, Wolfgang Schober, Alfred Haimerl, Joachim Mahler | 2008-12-16 |
| 7462940 | Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same | Michael Bauer, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2008-12-09 |
| 7443019 | Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same | Michael Bauer, Alfred Haimerl, Joachim Mahler, Wolfgang Schober | 2008-10-28 |