Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027436 | Package with clip having through hole accommodating component-related structure | Angela Kessler, Kok Yau Chua, Josef Hoeglauer, Chiah Chin Lim | 2024-07-02 |
| 11355429 | Electrical interconnect structure with radial spokes for improved solder void control | Paul Armand Asentista Calo, Tek Keong Gan, Ser Yee Keh, Tien Heng Lem, Fong Lim +1 more | 2022-06-07 |