CL

Chiah Chin Lim

Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
📍 Muar, MY: #8 of 12 inventorsTop 70%
Overall (All Time): #2,510,990 of 4,157,543Top 65%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12027436 Package with clip having through hole accommodating component-related structure Angela Kessler, Kok Yau Chua, Josef Hoeglauer, Mei Qi Tay 2024-07-02