Issued Patents All Time
Showing 26–50 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627292 | Semiconductor housing with rear-side structuring | Ralf Otremba, Xaver Schloegel, Juergen Schredl | 2017-04-18 |
| 9515060 | Multi-chip semiconductor power device | Ralf Otremba, Xaver Schloegel, Chooi Mei Chong | 2016-12-06 |
| 9449902 | Semiconductor packages having multiple lead frames and methods of formation thereof | Ralf Otremba, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2016-09-20 |
| 9437548 | Chip package and method for manufacturing the same | Henrik Ewe, Anton Prueckl, Joachim Mahler, Frank Daeche, Riccardo Pittassi | 2016-09-06 |
| 9412626 | Method for manufacturing a chip arrangement | Ralf Otremba, Juergen Schredl, Xaver Schloegel, Klaus Schiess, Bernd Roemer +1 more | 2016-08-09 |
| 9397018 | Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit | Ralf Otremba, Juergen Schredl, Xaver Schloegel, Wolfram Hable, Manfred Mengel +2 more | 2016-07-19 |
| 9362240 | Electronic device | Khalil Hosseini, Joachim Mahler, Ralf Otremba, Juergen Schredl, Xaver Schloegel +1 more | 2016-06-07 |
| 9331060 | Device including two power semiconductor chips and manufacturing thereof | Ralf Otremba, Joachim Mahler, Johannes Lodermeyer | 2016-05-03 |
| 9263440 | Power transistor arrangement and package having the same | Ralf Otremba, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2016-02-16 |
| 9230880 | Electronic device and method for fabricating an electronic device | Ralf Otremba, Juergen Schredl, Teck Sim Lee, Xaver Schloegel, Klaus Schiess | 2016-01-05 |
| 9184066 | Chip arrangements and methods for manufacturing a chip arrangement | Ralf Otremba, Juergen Schredl, Xaver Schloegel, Klaus Schiess, Bernd Roemer +1 more | 2015-11-10 |
| 9147631 | Semiconductor power device having a heat sink | Ralf Otremba, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2015-09-29 |
| 9147628 | Package-in-packages and methods of formation thereof | Ralf Otremba, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2015-09-29 |
| 9117786 | Chip module, an insulation material and a method for fabricating a chip module | Ralf Otremba, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2015-08-25 |
| 9099441 | Power transistor arrangement and method for manufacturing the same | Ralf Otremba, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2015-08-04 |
| 9059083 | Semiconductor device | Henrik Ewe, Joachim Mahler, Manfred Mengel, Reimund Engl, Jochen Dangelmaier | 2015-06-16 |
| 9059155 | Chip package and method for manufacturing the same | Henrik Ewe, Anton Prueckl, Joachim Mahler, Frank Daeche, Riccardo Pittassi | 2015-06-16 |
| 9035437 | Packaged device comprising non-integer lead pitches and method of manufacturing the same | Ralf Otremba, Guenther Lohmann, Teck Sim Lee, Matteo-Alessandro Kutschak, Wolfgang Peinhopf | 2015-05-19 |
| 9018744 | Semiconductor device having a clip contact | Ralf Otremba, Khalil Hosseini | 2015-04-28 |
| 8987880 | Chip module and a method for manufacturing a chip module | Ralf Otremba, Xaver Schloegel | 2015-03-24 |
| 8975117 | Semiconductor device using diffusion soldering | Ralf Otremba, Fong Lim, Abdul Rahman Mohamed, Chooi Mei Chong, Ida Fischbach +2 more | 2015-03-10 |
| 8975711 | Device including two power semiconductor chips and manufacturing thereof | Ralf Otremba, Joachim Mahler, Johannes Lodermeyer | 2015-03-10 |
| 8970032 | Chip module and method for fabricating a chip module | Ralf Otremba, Martin Standing | 2015-03-03 |
| 8933555 | Semiconductor chip package | Ralf Otremba | 2015-01-13 |
| 8896106 | Semiconductor packages having multiple lead frames and methods of formation thereof | Ralf Otremba, Juergen Schredl, Xaver Schloegel, Klaus Schiess | 2014-11-25 |