Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971457 | Semiconductor device comprising a composite material clip | Thomas Bemmerl, Thorsten Scharf | 2021-04-06 |
| 10964628 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Thorsten Scharf, Josef Hoeglauer, Michael Juerss, Josef Maerz, Thorsten Meyer +1 more | 2021-03-30 |
| 10886186 | Semiconductor package system | Thorsten Scharf, Ralf Otremba, Thomas Bemmerl, Irmgard Escher-Poeppel, Michael Juerss +2 more | 2021-01-05 |
| 10685909 | Power package having multiple mold compounds | Edward Fuergut | 2020-06-16 |
| 10629575 | Stacked die semiconductor package with electrical interposer | Thorsten Scharf, Carsten Ahrens, Helmut Brech, Thorsten Meyer, Matthias Zigldrum | 2020-04-21 |
| 10418313 | Electronic module comprising a plurality of encapsulation layers and a method for producing it | Edward Fuergut, Juergen Hoegerl | 2019-09-17 |
| 10373895 | Semiconductor device having die pads with exposed surfaces | Edward Fuergut, Wolfgang Scholz, Ralf Otremba | 2019-08-06 |
| 10229885 | Method of galvanic plating assisted by a current distribution layer | Steffen Jordan | 2019-03-12 |
| 10168391 | Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto | Giuliano Angelo Babulano, Jens Oetjen, Liu Chen, Toni Salminen, Stefan Mieslinger +4 more | 2019-01-01 |
| 10153766 | Switch device | Anton Mauder, Goran Keser | 2018-12-11 |
| 10096584 | Method for producing a power semiconductor module | Olaf Hohlfeld, Guido Boenig, Irmgard Escher-Poeppel, Edward Fuergut, Thorsten Meyer | 2018-10-09 |
| 10079195 | Semiconductor chip package comprising laterally extending connectors | Wolfram Hable, Juergen Hoegerl | 2018-09-18 |
| 10062671 | Circuit board embedding a power semiconductor chip | Angela Kessler, Thorsten Scharf | 2018-08-28 |
| 10037972 | Electronic module comprising fluid cooling channel and method of manufacturing the same | Edward Fuergut, Wolfram Hable | 2018-07-31 |
| 10014275 | Method for producing a chip assemblage | Alexander Heinrich, Irmgard Escher-Poeppel, Andreas Munding, Catharina Wille | 2018-07-03 |
| 9857439 | Sensor arrangement, circuit arrangement and method of manufacturing a sensor arrangement | Franz Jost, Holger Wille | 2018-01-02 |
| 9564578 | Semiconductor package with integrated magnetic field sensor | Thorsten Meyer, Rainer Markus Schaller, Franz Jost, Stefan Mieslinger, Liu Chen +4 more | 2017-02-07 |
| 9524932 | Semiconductor device with combined passive device on chip back side | Andreas Munding | 2016-12-20 |
| 9140735 | Integration of current measurement in wiring structure of an electronic circuit | Angela Kessler | 2015-09-22 |
| 9123735 | Semiconductor device with combined passive device on chip back side | Andreas Munding | 2015-09-01 |
| 7971576 | Internal combustion engine and method for operating an internal combustion engine | Thomas Reuss, Axel Macher | 2011-07-05 |
| 7707998 | Internal combustion engine and method for operating an internal combustion engine | Thomas Reuss, Axel Macher | 2010-05-04 |
| 6564583 | Jewelry with girdle-grooved stone | — | 2003-05-20 |
| 6489675 | Optical semiconductor component with an optically transparent protective layer | Gernot Althammer | 2002-12-03 |
| D258123 | Ring | — | 1981-02-03 |