Issued Patents All Time
Showing 51–75 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9953846 | Method for fabricating a semiconductor chip panel | Daniel Porwol | 2018-04-24 |
| 9922910 | Functionalized interface structure | Ralf Otremba, Christian Kasztelan, Hsieh Ting Kuek, Teck Sim Lee, Sanjay Kumar Murugan +1 more | 2018-03-20 |
| 9837288 | Semiconductor power package and method of manufacturing the same | Thomas Basler, Christian Kasztelan, Ralf Otremba | 2017-12-05 |
| 9768037 | Electronic device package including metal blocks | Petteri Palm, Irmgard Escher-Poeppel | 2017-09-19 |
| 9698070 | Arrangement having a plurality of chips and a chip carrier, and a processing arrangement | Michael Ledutke | 2017-07-04 |
| 9666499 | Semiconductor device with encapsulant | Joachim Mahler, Khalil Hosseini, Georg Meyer-Berg | 2017-05-30 |
| 9627287 | Thinning in package using separation structure as stop | Manfred Engelhardt, Hannes Eder | 2017-04-18 |
| 9595502 | Spring contact for semiconductor chip | Olaf Hohlfeld, Horst Groeninger, Juergen Hoegerl | 2017-03-14 |
| 9593009 | Apparatus comprising and a method for manufacturing an embedded MEMS device | Horst Theuss, Rainer Leuschner | 2017-03-14 |
| 9589859 | Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Gottfried Beer, Juergen Hoegerl, Olaf Hohlfeld, Peter Kanschat | 2017-03-07 |
| 9584889 | System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille | Irmgard Escher-Poeppel, Alfons Dehe | 2017-02-28 |
| 9496228 | Integrated circuit and method of manufacturing an integrated circuit | Joachim Mahler, Ivan Nikitin | 2016-11-15 |
| 9455160 | Method for fabricating a semiconductor chip panel | Daniel Porwol | 2016-09-27 |
| 9437513 | Electrically insulating thermal interface on the discontinuity of an encapsulation structure | Manfred Mengel | 2016-09-06 |
| 9412626 | Method for manufacturing a chip arrangement | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess +1 more | 2016-08-09 |
| 9395404 | Method for testing semiconductor chips or semiconductor chip modules | Horst Groeninger | 2016-07-19 |
| 9355881 | Semiconductor device including a dielectric material | Bernhard Goller, Eva-Maria Hess, Christian Schweiger | 2016-05-31 |
| 9349680 | Chip arrangement and method of manufacturing the same | Joachim Mahler, Peter Strobel | 2016-05-24 |
| 9318473 | Semiconductor device including a polymer disposed on a carrier | Joachim Mahler, Khalil Hosseini, Manfred Mengel | 2016-04-19 |
| 9275916 | Removable indicator structure in electronic chips of a common substrate for process adjustment | Irmgard Escher-Poeppel, Manfred Engelhardt, Hans-Joerg Timme, Hannes Eder | 2016-03-01 |
| 9230894 | Methods for manufacturing a chip package | Irmgard Escher-Poeppel | 2016-01-05 |
| 9196568 | Arrangement and method for manufacturing the same | Thomas Fischer, Carsten Ahrens, Damian Sojka, Andre Schmenn | 2015-11-24 |
| 9184066 | Chip arrangements and methods for manufacturing a chip arrangement | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess +1 more | 2015-11-10 |
| 9171804 | Method for fabricating an electronic component | Georg Meyer-Berg, Khalil Hosseini, Joachim Mahler | 2015-10-27 |
| 9129959 | Method for manufacturing an electronic module and an electronic module | Irmgard Escher-Poeppel, Gottfried Beer | 2015-09-08 |