Issued Patents All Time
Showing 76–100 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9123806 | Method of manufacturing a semiconductor device | Joachim Mahler | 2015-09-01 |
| 9082767 | Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package | Joachim Mahler, Khalil Hosseini, Georg Meyer-Berg | 2015-07-14 |
| 9064869 | Semiconductor module and a method for fabrication thereof by extended embedding technologies | Juergen Hoegerl, Gottfried Beer, Olaf Hohlfeld | 2015-06-23 |
| 9040346 | Semiconductor package and methods of formation thereof | Ivan Nikitin | 2015-05-26 |
| 9041226 | Chip arrangement and a method of manufacturing a chip arrangement | Rainer Steiner, Khalil Hosseini, Georg Meyer-Berg, Joachim Mahler | 2015-05-26 |
| 8901739 | Embedded chip package, a chip package, and a method for manufacturing an embedded chip package | Horst Theuss, Walter Diez | 2014-12-02 |
| 8872288 | Apparatus comprising and a method for manufacturing an embedded MEMS device | Horst Theuss, Rainer Leuschner | 2014-10-28 |
| 8815651 | Method for manufacturing an electronic device by reducing thickness of electronic members attached to a carrier | Joachim Mahler | 2014-08-26 |
| 8786111 | Semiconductor packages and methods of formation thereof | Joachim Mahler, Khalil Hosseini, Hans-Joerg Timme | 2014-07-22 |
| 8778733 | Semiconductor package and methods of formation thereof | Joachim Mahler, Khalil Hosseini | 2014-07-15 |
| 8749029 | Method of manufacturing a semiconductor device | Joachim Mahler | 2014-06-10 |
| 8728873 | Methods for filling a contact hole in a chip package arrangement and chip package arrangements | Benjamin Alles, Joachim Mahler, Ivan Nikitin | 2014-05-20 |
| 8692361 | Electric device package comprising a laminate and method of making an electric device package comprising a laminate | Joachim Mahler, Khalil Hosseini, Georg Meyer-Berg | 2014-04-08 |
| 8648456 | Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package | Joachim Mahler, Khalil Hosseini, Georg Meyer-Berg | 2014-02-11 |
| 8580070 | Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer | Hermann Vilsmeier, Simon Jerebic, Michael Bauer | 2013-11-12 |
| 8574966 | Semiconductor device having a semiconductor chip, and method for the production thereof | Michael Bauer | 2013-11-05 |
| 8524542 | Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same | Markus Brunnbauer | 2013-09-03 |
| 8450148 | Molding compound adhesion for map-molded flip-chip | Joachim Mahler | 2013-05-28 |
| 8431063 | Heat treatment for a panel and apparatus for carrying out the heat treatment method | Gottfried Beer, Markus Brunnbauer | 2013-04-30 |
| 8394308 | Mold method | Markus Brunnbauer, Daniel Porwol | 2013-03-12 |
| 8288207 | Method of manufacturing semiconductor devices | Joachim Mahler, Manfred Mengel | 2012-10-16 |
| 8247897 | Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same | Markus Brunnbauer | 2012-08-21 |
| 8168472 | Semiconductor device having a semiconductor chip, and method for the production thereof | Michael Bauer | 2012-05-01 |
| 8158046 | Mold apparatus and method | Markus Brunnbauer, Daniel Porwol | 2012-04-17 |
| 8148210 | Method for fabricating a semiconductor chip panel | Markus Fink | 2012-04-03 |