Issued Patents All Time
Showing 26–50 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11040872 | Semiconductor module | Claus Waechter, Bernd Goller, Michael Ledutke, Dominic Maier | 2021-06-22 |
| 10916515 | Systems and methods using an RF circuit on isolating material | Carsten Ahrens, Anton Steltenpohl, Anneliese Mueller | 2021-02-09 |
| 10734250 | Method of manufacturing a package having a power semiconductor chip | Thomas Basler, Christian Kasztelan, Ralf Otremba | 2020-08-04 |
| 10685909 | Power package having multiple mold compounds | Martin Gruber | 2020-06-16 |
| 10573533 | Method of reducing a sheet resistance in an electronic device, and an electronic device | Irmgard Escher-Poeppel, Stephanie Fassl, Paul Ganitzer, Gerhard Poeppel, Werner Schustereder +1 more | 2020-02-25 |
| 10483133 | Method for fabricating a semiconductor chip panel | Daniel Porwol | 2019-11-19 |
| 10435292 | Method for producing a semiconductor module | Claus Waechter, Bernd Goller, Michael Ledutke, Dominic Maier | 2019-10-08 |
| 10418313 | Electronic module comprising a plurality of encapsulation layers and a method for producing it | Martin Gruber, Juergen Hoegerl | 2019-09-17 |
| 10373895 | Semiconductor device having die pads with exposed surfaces | Martin Gruber, Wolfgang Scholz, Ralf Otremba | 2019-08-06 |
| 10373897 | Semiconductor devices with improved thermal and electrical performance | Ralf Otremba, Felix Grawert, Amirul Afiq Hud, Uwe Kirchner, Teck Sim Lee +5 more | 2019-08-06 |
| 10361138 | Method for manufacturing an arrangement including a chip carrier notch | Michael Ledutke | 2019-07-23 |
| 10347554 | Spatially selective roughening of encapsulant to promote adhesion with functional structure | Norbert Joson Santos, Sanjay Kumar Murugan | 2019-07-09 |
| 10256119 | Method of manufacturing a semiconductor power package | Thomas Basler, Christian Kasztelan, Ralf Otremba | 2019-04-09 |
| 10177112 | Attaching chip attach medium to already encapsulated electronic chip | Joachim Mahler, Georg Meyer-Berg | 2019-01-08 |
| 10125012 | MEMS device | Horst Theuss | 2018-11-13 |
| 10121690 | Method of manufacturing a semiconductor component and semiconductor component | Georg Meyer-Berg, Joachim Mahler | 2018-11-06 |
| 10115646 | Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement | Juergen Hoegerl | 2018-10-30 |
| 10096584 | Method for producing a power semiconductor module | Olaf Hohlfeld, Guido Boenig, Irmgard Escher-Poeppel, Martin Gruber, Thorsten Meyer | 2018-10-09 |
| 10049962 | Arrangement of multiple power semiconductor chips and method of manufacturing the same | Georg Meyer-Berg, Joachim Mahler | 2018-08-14 |
| 10043782 | Electronic device package having a dielectric layer and an encapsulant | Holger Doepke, Olaf Hohlfeld, Michael Juerss | 2018-08-07 |
| 10037972 | Electronic module comprising fluid cooling channel and method of manufacturing the same | Martin Gruber, Wolfram Hable | 2018-07-31 |
| 10020285 | Method of producing a semiconductor device and a semiconductor device | Manfred Engelhardt, Hannes Eder, Bernd Roemer | 2018-07-10 |
| 9984928 | Method for producing a number of chip assemblies and method for producing a semiconductor arrangement | Olaf Hohlfeld, Gottfried Beer, Juergen Hoegerl, Peter Kanschat | 2018-05-29 |
| 9979187 | Power device with overvoltage arrester | Thomas Basler, Stephan Voss | 2018-05-22 |
| 9966277 | Arrangement and method for manufacturing the same | Markus Zundel, Andre Schmenn, Damian Sojka, Isabella Goetz, Gudrun Stranzl +3 more | 2018-05-08 |