Issued Patents All Time
Showing 101–125 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8062928 | Semiconductor device having a semiconductor chip, and method for the production thereof | Michael Bauer | 2011-11-22 |
| 7994646 | Semiconductor device | Joachim Mahler, Manfred Mengel, Ivan Nikitin | 2011-08-09 |
| 7968378 | Electronic device | Joachim Mahler, Louis Vervoort | 2011-06-28 |
| 7943423 | Reconfigured wafer alignment | Jens Pohl, Markus Brunnbauer, Thorsten Meyer, Peter Strobel, Daniel Porwol +1 more | 2011-05-17 |
| 7944061 | Semiconductor device having through contacts through a plastic housing composition and method for the production thereof | Michael Bauer, Thomas Bemmerl, Simon Jerebic, Christian Stuempfl, Horst Theuss +1 more | 2011-05-17 |
| 7935622 | Support with solder ball elements and a method for populating substrates with solder balls | Michael Bauer, Thomas Bemmerl, Simon Jerebic, Herman Vilsmeier | 2011-05-03 |
| 7932180 | Manufacturing a semiconductor device via etching a semiconductor chip to a first layer | Joachim Mahler | 2011-04-26 |
| 7923350 | Method of manufacturing a semiconductor device including etching to etch stop regions | Joachim Mahler, Werner Kroeninger | 2011-04-12 |
| 7915089 | Encapsulation method | Irmgard Escher-Poeppel, Markus Brunnbauer | 2011-03-29 |
| 7893532 | External contact material for external contacts of a semiconductor device and method of making the same | Michael Bauer, Irmgard Escher-Poeppel, Simon Jerebic, Bernd Rakow, Peter Strobel +1 more | 2011-02-22 |
| 7883993 | Semiconductor device with semiconductor chip and rewiring layer and method for producing the same | Hermann Vilsmeier, Holger Woerner | 2011-02-08 |
| 7843055 | Semiconductor device having an adhesion promoting layer and method for producing it | Michael Bauer, Markus Brunnbauer, Joachim Mahler | 2010-11-30 |
| 7830026 | Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip | Gottfried Beer | 2010-11-09 |
| 7800241 | Semiconductor device with semiconductor device components embedded in a plastics composition | Michael Bauer, Thomas Bemmerl | 2010-09-21 |
| 7795742 | Semiconductor device having a semiconductor chip, and method for the production thereof | Michael Bauer | 2010-09-14 |
| 7767495 | Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material | Joachim Mahler, Carsten von Koblinski, Ivan Nikitin | 2010-08-03 |
| 7759805 | Semiconductor device encapsulated by an electrically conductive plastic housing composition with conductive particles | Gottfried Beer | 2010-07-20 |
| 7732242 | Composite board with semiconductor chips and plastic housing composition and method | Markus Brunnbauer, Jesus Mennen Belonio, Jr., Thorsten Meyer | 2010-06-08 |
| 7713791 | Panel and semiconductor device having a composite plate with semiconductor chips | Michael Bauer, Thomas Bemmerl, Simon Jerebic, Hermann Vilsmeier | 2010-05-11 |
| 7709379 | Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof | Michael Bauer, Thomas Bemmerl, Markus Fink, Horst Groeninger, Hermann Vilsmeier | 2010-05-04 |
| 7700956 | Sensor component and panel used for the production thereof | Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel +1 more | 2010-04-20 |
| 7674654 | Producing thin integrated semiconductor devices | Markus Brunnbauer, Werner Kroeninger | 2010-03-09 |
| 7663218 | Integrated circuit component with a surface-mount housing | Michael Bauer, Simon Jerebic, Hermann Vilsmeier | 2010-02-16 |
| 7622733 | Semiconductor structure with a plastic housing and separable carrier plate | Thomas Kalin, Holger Woerner, Carsten von Koblinski | 2009-11-24 |
| 7585701 | Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film | Gottfried Beer, Markus Brunnbauer, Irmgard Escher-Poeppel | 2009-09-08 |