Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10332814 | Bonded system and a method for adhesively bonding a hygroscopic material | Claus von Waechter, Christian Altschaeffl, Holger Doepke, Uwe Hoeckele, Franz-Xaver Muehlbauer +3 more | 2019-06-25 |
| 9355881 | Semiconductor device including a dielectric material | Bernhard Goller, Eva-Maria Hess, Edward Fuergut | 2016-05-31 |
| 8889767 | Thermoplastic molding compounds based on styrene copolymers and polyamides having improved weathering resistance | Martin Weber, Marko Blinzler, Christoph Schneidereit | 2014-11-18 |
| 5821302 | Shaped articles comprising thermoplastic molding materials | Bernhard Rosenau, Graham Edmund Mc Kee | 1998-10-13 |