Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002685 | Method for packaging chip | Fei She, Dewen Tian, Qinglin Song | 2024-06-04 |
| 9093438 | Semiconductor device package with cap element | Junhua Luo, Deguo Sun | 2015-07-28 |
| 8836105 | Semiconductor device package with cap element | Junhua Luo, Deguo Sun | 2014-09-16 |
| 8722465 | Method of assembling semiconductor device including insulating substrate and heat sink | Junhua Luo, Jinzhong Yao | 2014-05-13 |
| 8643170 | Method of assembling semiconductor device including insulating substrate and heat sink | Junhua Luo, Jinzhong Yao | 2014-02-04 |
| 8354739 | Thin semiconductor package and method for manufacturing same | Yeqing Su, Zhigang Bai, Weimin Chen, Wei Shen, Jianhong Wang +1 more | 2013-01-15 |