Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107053 | Shielding process for SIP packaging | Juncheng Guo, Qinglin Song | 2024-10-01 |
| 12074037 | Packaging method for circuit units comprising circuit baseplate | Haisheng Wang, Qinglin Song | 2024-08-27 |
| 12031920 | Method for detecting coverage rate of intermetallic compound | Dingguo Zhong, Qinglin Song | 2024-07-09 |
| 12002685 | Method for packaging chip | Baoguan Yin, Fei She, Qinglin Song | 2024-06-04 |
| 11882681 | Electromagnetic shielding structure and manufacturing method thereof, and electronic device | Kaiwei Wang, Qinglin Song | 2024-01-23 |
| 10014272 | Die bonding with liquid phase solder | Yiu Ming Cheung, Ming-Yang Li | 2018-07-03 |
| 8657180 | Bond pad assessment for wire bonding | Ming-Yang Li, Madhukumar Janardhanan Pillai | 2014-02-25 |