Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387944 | Semiconductor device and method of manufacturing semiconductor device | Chih-Piao Chuu, Lain-Jong Li | 2025-08-12 |
| 12369362 | Forming semiconductor structures with two-dimensional materials | Chao-Ching Cheng, Hung-Li Chiang, Chun-Chieh Lu, Tzu-Chiang Chen | 2025-07-22 |
| 12174526 | Pellicle for an EUV lithography mask and a method of manufacturing thereof | Tzu-Ang Chao, Chao-Ching Cheng, Han Wang, Gregory Michael Pitner | 2024-12-24 |
| 12046665 | Forming semiconductor structures with two-dimensional materials | Chao-Ching Cheng, Hung-Li Chiang, Chun-Chieh Lu, Tzu-Chiang Chen | 2024-07-23 |
| 12021019 | Semiconductor device package with thermal pad | Anindya Poddar, Ashok S. Prabhu, Edgar Dorotyao Balidoy, Hau Nguyen, Makoto Yoshino | 2024-06-25 |
| 11923203 | Semiconductor device and method of manufacturing semiconductor device | Chih-Piao Chuu, Lain-Jong Li | 2024-03-05 |
| 11600720 | Forming semiconductor structures with two-dimensional materials | Chao-Ching Cheng, Hung-Li Chiang, Chun-Chieh Lu, Tzu-Chiang Chen | 2023-03-07 |
| 11581185 | Field effect transistor using transition metal dichalcogenide and a method for forming the same | Lain-Jong Li, Chih-Piao Chuu | 2023-02-14 |
| 11527659 | Semiconductor device and manufacturing method thereof | Lain-Jong Li, Han-Cheng YEH, Wen-Hao Chang | 2022-12-13 |
| 11464124 | Curved display and method for binding cover glass of curved display | Chung-Hung Lin, Po-Lin Chen, Yen-Heng Huang | 2022-10-04 |
| 11430666 | Semiconductor device and method of manufacturing semiconductor device | Chih-Piao Chuu, Lain-Jong Li | 2022-08-30 |
| 11329170 | Semiconductor device having a lateral semiconductor heterojunction and method | Jing Huang, Lain-Jong Li | 2022-05-10 |
| 11037783 | Field effect transistor using transition metal dichalcogenide and a method for forming the same | Lain-Jong Li, Chih-Piao Chuu | 2021-06-15 |
| 11004965 | Forming semiconductor structures with two-dimensional materials | Chao-Ching Cheng, Hung-Li Chiang, Chun-Chieh Lu, Tzu-Chiang Chen | 2021-05-11 |
| 10998452 | Semiconductor device having a lateral semiconductor heterojunction and method | Jing Huang, Lain-Jong Li | 2021-05-04 |
| 10186549 | Gang bonding process for assembling a matrix of light-emitting elements | Yiu Ming Cheung, Zetao MA, Kai Ming Yeung | 2019-01-22 |
| 10014272 | Die bonding with liquid phase solder | Dewen Tian, Yiu Ming Cheung | 2018-07-03 |
| 9944108 | Sticky note pad | Tsung-Tien Kuo, Jen-Rong Liu, Tsun-Rung Hsu, Chih-Wei Hsu | 2018-04-17 |
| 9908356 | Carbonless copy note pad | Tsung-Tien Kuo, Hsien-Min Kuo, Ho-Tsai Lin | 2018-03-06 |
| 9583366 | Thermally-enhanced provision of underfill to electronic devices using a stencil | Qinglong Zhang, John Hon-Shing Lau, Michael Zahn, Yiu Ming Cheung | 2017-02-28 |
| 9536987 | Line-end cutting method for fin structures of FinFETs formed by double patterning technology | Chunyan Yi | 2017-01-03 |
| 9337017 | Method for repairing damages to sidewalls of an ultra-low dielectric constant film | Shaohai Zeng, Qingyun Zuo | 2016-05-10 |
| 8967452 | Thermal compression bonding of semiconductor chips | Yiu Ming Cheung, Tsan Yin Peter Lo, Yick Hong Mak, Ka San Lam | 2015-03-03 |
| 8956892 | Method and apparatus for fabricating a light-emitting diode package | Kui Kam Lam, Ka Yee Mak, Yiu Yan Wong | 2015-02-17 |
| 8657180 | Bond pad assessment for wire bonding | Dewen Tian, Madhukumar Janardhanan Pillai | 2014-02-25 |