Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11136202 | Direct transfer apparatus for electronic components | Kai Siu LAM, Yen Hsi Tang, Hung Kit Chan, Ka Yee Mak | 2021-10-05 |
| 11056377 | Collet inspection in a semiconductor pick and place apparatus | Kai Siu LAM, Cheuk Ki Tam, Nim Tak WONG, Ka Yee Mak | 2021-07-06 |
| 10882298 | System for adjusting relative positions between components of a bonding apparatus | Shui Cheung Woo, Liang Tang, Wan Yin YAU, Wai Yuen Cheung | 2021-01-05 |
| 10399170 | Die attachment apparatus and method utilizing activated forming gas | Pingliang Tu, Zhao Yang, Jun Qi, Chun Hung Samuel Ip | 2019-09-03 |
| 10311597 | Apparatus and method of determining a bonding position of a die | Shun Ming Fung, Chi Keung Leung, Wing Kin Lam, Yuet Keung Cheung | 2019-06-04 |
| 10014203 | Pick and place device comprising pick arm correction module | Kai Siu LAM, Zhuanyun Zhang, Nim Tak WONG, Chung Yan LAU | 2018-07-03 |
| 9989587 | Apparatus for testing multiple semiconductor dice with increased throughput | Yam Mo Wong, Kai Siu LAM, Ka Wai Paul Chan | 2018-06-05 |
| 8956892 | Method and apparatus for fabricating a light-emitting diode package | Ka Yee Mak, Yiu Yan Wong, Ming-Yang Li | 2015-02-17 |
| 8804136 | Apparatus and method for locating a plurality of placement positions on a carrier object | Yen Hsi Tang, Wenling Chan, Shun Ming Fung | 2014-08-12 |
| 8590143 | Apparatus for delivering semiconductor components to a substrate | Yen Hsi Tang, Wai Yuen Cheung, Wing Kin Lam | 2013-11-26 |
| 8293043 | Automatic level adjustment for die bonder | Kwok Kee Chung, Chi Keung Leung, Wai Yuen Cheung | 2012-10-23 |
| 7977231 | Die bonder incorporating dual-head dispenser | Yen Hsi Tang, Yiu Yan Wong, Hok Man WAN | 2011-07-12 |
| 7735715 | Dispensing solder for mounting semiconductor chips | Chun Hung Samuel Ip | 2010-06-15 |
| 7648901 | Manufacturing process and apparatus therefor utilizing reducing gas | Ping Liang Tu, Deming Liu, Man Chung Ng | 2010-01-19 |
| 7179346 | Semiconductor apparatus with multiple delivery devices for components | Man Chung Ng, Yen Hsi Tang | 2007-02-20 |
| 6991967 | Apparatus and method for die attachment | Deming Liu, Ran Fu, Man Chung Ng, Wai Yuen Cheung | 2006-01-31 |