Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8905109 | Apparatus for bonding substrates to each other | Wai Lik Alik Chan, Kwok Kei Wong | 2014-12-09 |
| 8821659 | Apparatus and method for real-time alignment and lamination of substrates | Man Lai Chau | 2014-09-02 |
| D708913 | Plastic container | — | 2014-07-15 |
| 8633089 | Die bonding method utilizing rotary wafer table | Keung Chau | 2014-01-21 |
| 8397785 | Transfer apparatus for multiple adhesives | Keung Chau, Wing Fai Lam | 2013-03-19 |
| 8336757 | Apparatus for transporting substrates for bonding | Wing Fai Lam, Chung Wai Ku | 2012-12-25 |
| 8166638 | Rotary clip bonder | Wai Lik Alik Chan, Ching Yuen To | 2012-05-01 |
| 7648901 | Manufacturing process and apparatus therefor utilizing reducing gas | Ping Liang Tu, Deming Liu, Kui Kam Lam | 2010-01-19 |
| 7179346 | Semiconductor apparatus with multiple delivery devices for components | Kui Kam Lam, Yen Hsi Tang | 2007-02-20 |
| 7084532 | Decoupling of actuators for positioning an object | Gary Peter Widdowson, Yen Hsi Tang | 2006-08-01 |
| 6991967 | Apparatus and method for die attachment | Deming Liu, Ran Fu, Kui Kam Lam, Wai Yuen Cheung | 2006-01-31 |
| D385752 | Microwavable meat holder | — | 1997-11-04 |