Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10882298 | System for adjusting relative positions between components of a bonding apparatus | Shui Cheung Woo, Liang Tang, Wan Yin YAU, Kui Kam Lam | 2021-01-05 |
| 8590143 | Apparatus for delivering semiconductor components to a substrate | Kui Kam Lam, Yen Hsi Tang, Wing Kin Lam | 2013-11-26 |
| 8293043 | Automatic level adjustment for die bonder | Kwok Kee Chung, Kui Kam Lam, Chi Keung Leung | 2012-10-23 |
| 6991967 | Apparatus and method for die attachment | Deming Liu, Ran Fu, Kui Kam Lam, Man Chung Ng | 2006-01-31 |