Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600516 | Die ejector height adjustment | Chi Wah Cheng, Kwok Pun Law | 2023-03-07 |
| 11343949 | Apparatus and method for dispensing a viscous adhesive | Chi Wah Cheng | 2022-05-24 |
| 11289445 | Die bonder incorporating rotatable adhesive dispenser head | See Lok Chan, Chi Wah Cheng | 2022-03-29 |
| 10882298 | System for adjusting relative positions between components of a bonding apparatus | Shui Cheung Woo, Liang Tang, Wai Yuen Cheung, Kui Kam Lam | 2021-01-05 |
| 10096568 | Die bonding tool and system | Kwok Yuen CHEUNG, Kwok Wah Tong, Jin Hui Meng, Man Kit Chow | 2018-10-09 |
| 10050008 | Method and system for automatic bond arm alignment | Shui Cheung Woo, Liang Tang | 2018-08-14 |