Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289445 | Die bonder incorporating rotatable adhesive dispenser head | Wan Yin YAU, Chi Wah Cheng | 2022-03-29 |
| 7726540 | Apparatus and method for arranging devices for processing | Chi Wah Cheng, Hoi Shuen TANG, Tim Wai Tony Mak | 2010-06-01 |