Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8293043 | Automatic level adjustment for die bonder | Kui Kam Lam, Chi Keung Leung, Wai Yuen Cheung | 2012-10-23 |
| 7854365 | Direct die attach utilizing heated bond head | Ming-Da Li, Ying Ding, Ping Liang Tu, King Ming Lo | 2010-12-21 |
| 7810698 | Vision system for positioning a bonding tool | Wing Hong Leung, Ka Fai Fung, Chi Leung Mok, Shun Ming Fung | 2010-10-12 |