Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10311597 | Apparatus and method of determining a bonding position of a die | Kui Kam Lam, Chi Keung Leung, Wing Kin Lam, Yuet Keung Cheung | 2019-06-04 |
| 8804136 | Apparatus and method for locating a plurality of placement positions on a carrier object | Kui Kam Lam, Yen Hsi Tang, Wenling Chan | 2014-08-12 |
| 7810698 | Vision system for positioning a bonding tool | Kwok Kee Chung, Wing Hong Leung, Ka Fai Fung, Chi Leung Mok | 2010-10-12 |
| 7676114 | Imaging system for three-dimensional reconstruction of surface profiles | Chi Kit Ronald Chung, Jun Cheng, Y. Edmund Lam, Fan Wang, Wing Hong Leung | 2010-03-09 |