Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8012866 | Method of bonding semiconductor devices utilizing solder balls | Chun Hung Samuel Ip | 2011-09-06 |
| 7854365 | Direct die attach utilizing heated bond head | Ming-Da Li, Ying Ding, King Ming Lo, Kwok Kee Chung | 2010-12-21 |
| 7648901 | Manufacturing process and apparatus therefor utilizing reducing gas | Deming Liu, Kui Kam Lam, Man Chung Ng | 2010-01-19 |