Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10399170 | Die attachment apparatus and method utilizing activated forming gas | Kui Kam Lam, Pingliang Tu, Zhao Yang, Jun Qi | 2019-09-03 |
| 8012866 | Method of bonding semiconductor devices utilizing solder balls | Ping Liang Tu | 2011-09-06 |
| 7735715 | Dispensing solder for mounting semiconductor chips | Kui Kam Lam | 2010-06-15 |