Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861714 | Heating of a substrate for epoxy deposition | Pak Lun Cheng, Jun Qi, Yong Wang, CHAO-YU LIU, Ka Fai Fung | 2020-12-08 |
| 10399170 | Die attachment apparatus and method utilizing activated forming gas | Kui Kam Lam, Zhao Yang, Jun Qi, Chun Hung Samuel Ip | 2019-09-03 |